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1

Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs

S. Azzopardi, A. Kawamura, H. Iwamoto, O. Briat, J.M. Vinassa, E. Woirgard, C. Zardini

Journal:

Microelectronics Reliability

Year:

2001

File:

PDF, 412 KB

2001

2

Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions

A. Benmansour, S. Azzopardi, J.C. Martin, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 567 KB

english, 2007

3

Remaining useful life prediction of lithium batteries in calendar ageing for automotive applications

A. Eddahech, O. Briat, E. Woirgard, J.M. Vinassa

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 741 KB

english, 2012

4

Lifetime evaluation of nano-scale silver sintered power modules for automotive application based on experiments and finite elements modeling

Le Henaff, Francois, Azzopardi, Stephane, Woirgard, Eric, Youssef, Toni, Bontemps, Serge, Joguet, Julien

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2015

Language:

english

File:

PDF, 11.64 MB

english, 2015

5

[IEEE 2018 IEEE International Reliability Physics Symposium (IRPS) - Burlingame, CA (2018.3.11-2018.3.15)] 2018 IEEE International Reliability Physics Symposium (IRPS) - Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs

Chihani, Omar, Theolier, Loic, Deletage, Jean-Yves, Woirgard, Eric, Chihani, Omar, Bensoussan, Alain, Durier, Andre

Year:

2018

Language:

english

File:

PDF, 791 KB

english, 2018

6

[IEEE 2013 15th European Conference on Power Electronics and Applications (EPE) - Lille, France (2013.09.2-2013.09.6)] 2013 15th European Conference on Power Electronics and Applications (EPE) - Processing and characterization of a 100% low-temperature Ag-sintered three-dimensional structure

Masson, Amandine, Azzopardi, Stephane, Le Henaff, Francois, Deletage, Jean-Yves, Woirgard, Eric, Bontemps, Serge, Joguet, Julien

Year:

2013

Language:

english

File:

PDF, 883 KB

english, 2013

7

Failure mechanism of trench IGBT under short-circuit after turn-off

A. Benmansour, S. Azzopardi, J.C. Martin, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 1.51 MB

english, 2006

8

A systematic hard- and soft-switching performances evaluation of 1200 V punchthrough IGBT structures

Azzopardi, S., Vinassa, J.-M., Woirgard, E., Zardini, C., Briat, O.

Journal:

IEEE Transactions on Power Electronics

Year:

2004

Language:

english

File:

PDF, 961 KB

english, 2004

9

Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance

El Brouji, E.-H., Briat, O., Vinassa, J.-M., Bertrand, N., Woirgard, E.

Journal:

IEEE Transactions on Vehicular Technology

Year:

2009

Language:

english

File:

PDF, 3.20 MB

english, 2009

10

Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses

Chihani, Omar, Theolier, Loic, Bensoussan, Alain, Deletage, Jean-Yves, Durier, André, Woirgard, Eric

Journal:

Microelectronics Reliability

Year:

2018

Language:

english

File:

PDF, 923 KB

english, 2018

11

An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications

A. Micol, A. Zeanh, T. Lhommeau, S. Azzopardi, E. Woirgard, O. Dalverny, M. Karama

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 1.65 MB

english, 2009

12

IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?

S. Azzopardi, E. Woirgard, J.-M. Vinassa, O. Briat, C. Zardini

Journal:

Microelectronics Reliability

Year:

2003

File:

PDF, 1.04 MB

2003

13

New power module concept in PCB-embedded technology with silver sintering die attach

Tablati, A., Alayli, N., Youssef, T., Belnoue, O., Theolier, L., Woirgard, E.

Journal:

Microelectronics Reliability

Year:

2020

File:

PDF, 2.55 MB

2020

14

Evaluation of lead-free soldering for automotive applications

Alexandrine Guédon, Eric Woirgard, Christian Zardini

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 959 KB

2002

15

Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature

Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Deletage, Eric Woirgard

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 1.73 MB

english, 2010

16

Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach

Baccar, F., Azzopardi, S., Theolier, L., El Boubkari, K., Deletage, J-Y., Woirgard, E.

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.09 MB

english, 2013

17

[IEEE Multi-Physics simulation and Experiments in Microelectronics - Freiburg im Breisgau, Germany (2008.04.20-2008.04.23)] EuroSimE 2008 - International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems - Thermomechanical modelling and reliability study of an IGBT module for an aeronautical application

Zeanh, A., Dalverny, O., Karama, M., Woirgard, E., Azzopardi, S., Bouzourene, A., Casual, J., Mermet-Guyennet, M.

Year:

2008

Language:

english

File:

PDF, 1.55 MB

english, 2008

18

Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering

Barrière, M., Guédon-Gracia, A., Woirgard, E., Bontemps, S., Le Henaff, F.

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.96 MB

english, 2017

19

Specification and use of pulsed current profiles for ultracapacitors power cycling

W. Lajnef, J.-M. Vinassa, O. Briat, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 937 KB

english, 2005

20

A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization

F. Le Henaff, S. Azzopardi, J.Y. Deletage, E. Woirgard, S. Bontemps, J. Joguet

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 902 KB

english, 2012

21

Monitoring fading rate of ultracapacitors using online characterization during power cycling

W. Lajnef, J.-M. Vinassa, O. Briat, H. El Brouji, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 320 KB

english, 2007

22

Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations

GuÉdon-Gracia, Alexandrine, Woirgard, Eric, Zardini, Christian

Journal:

IEEE Transactions on Device and Materials Reliability

Year:

2008

Language:

english

File:

PDF, 969 KB

english, 2008

23

[IEEE 2011 IEEE Energy Conversion Congress and Exposition (ECCE) - Phoenix, AZ, USA (2011.09.17-2011.09.22)] 2011 IEEE Energy Conversion Congress and Exposition - Does power devices sensitivity to mechanical stresses can be used as sensor for power assembly health monitoring?

Capy, F., Azzopardi, S., El Boubkari, K., Belmehdi, Y., Deletage, J.-Y., Woirgard, E.

Year:

2011

Language:

english

File:

PDF, 1.31 MB

english, 2011

24

Study of die attach technologies for high temperature power electronics: Silver sintering and gold–germanium alloy

Sabbah, Wissam, Azzopardi, Stéphane, Buttay, Cyril, Meuret, Régis, Woirgard, Eric

Journal:

Microelectronics Reliability

Year:

2013

Language:

english

File:

PDF, 1.51 MB

english, 2013

25

Evaluation of the creep of the Sn/sub 62/Pb/sub 36/Ag/sub 2/ solder alloy by the measurement of the stresses in a silicon die

Rey, P., Woirgard, E., Thebaud, J.-M., Zardini, C.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Year:

1998

Language:

english

File:

PDF, 245 KB

english, 1998

26

Etude de la relaxation des joints de grains de l'argent de haute purete

J. Woirgard, J.P. Amirault, J. de Fouquet

Journal:

Scripta Metallurgica

Year:

1974

Language:

english

File:

PDF, 156 KB

english, 1974

27

A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation

A. Benmansour, S. Azzopardi, J.C. Martin, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 326 KB

english, 2007

28

Fem modelling of an electro-optical micro-shutter

P. Roux, E. Woirgard, M. Pizzi, O. De Martiis, V. Koniachkine

Journal:

Sensors and Actuators A: Physical

Year:

2005

Language:

english

File:

PDF, 426 KB

english, 2005

29

Correlation between Experimental Results and FE Simulations to Evaluate Lead-Free BGA Assembly Reliability

A. Guédon-Gracia, E. Woirgard, C. Zardini

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 1.45 MB

english, 2005

30

Power cycling tests for accelerated ageing of ultracapacitors

O. Briat, W. Lajnef, J.-M. Vinassa, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2006

Language:

english

File:

PDF, 3.43 MB

english, 2006

31

Methodology to evaluate the correspondence between real conditions and accelerated tests of a thyristor system used in a power plant

Alexandrine Guédon, Eric Woirgard, Christian Zardini, Guillaume Simon

Journal:

Microelectronics Reliability

Year:

2003

File:

PDF, 1.37 MB

2003

32

Principle, design and experimental validation of a flywheel-battery hybrid source for heavy-duty electric vehicles

Briat, O., Vinassa, J.M., Lajnef, W., Azzopardi, S., Woirgard, E.

Journal:

IET Electric Power Applications

Year:

2007

Language:

english

File:

PDF, 748 KB

english, 2007

33

Mechanical stress investigation after technological process in Deep Trench Termination DT2 using BenzoCycloButene as dielectric material

Arbess, H., Baccar, F., Theolier, L., Azzopardi, S., Woirgard, E.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.18 MB

english, 2015

34

Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity

Youssef, T., Rmili, W., Woirgard, E., Azzopardi, S., Vivet, N., Martineau, D., Meuret, R., Le Quilliec, G., Richard, C.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.89 MB

english, 2015

35

[IEEE 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Chicago, IL, USA (2015.5.3-2015.5.6)] 2015 IEEE International Workshop on Integrated Power Packaging (IWIPP) - Silver sintered double-sided cooling power package process for controlled Si power semiconductor devices with aluminum top-metallization

Barriere, M., Azzopardi, S., Roder, R., Favre, I., Woirgard, E., Bontemps, S., Le Henaff, F.

Year:

2015

Language:

english

File:

PDF, 3.71 MB

english, 2015

36

Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests

El Brouji, H., Briat, O., Vinassa, J.-M., Bertrand, N., Woirgard, E.

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 231 KB

english, 2008

37

Ageing monitoring of lithium-ion cell during power cycling tests

A. Eddahech, O. Briat, H. Henry, J.-Y. Delétage, E. Woirgard, J.-M. Vinassa

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 565 KB

english, 2011

38

How supercapacitors reach end of life criteria during calendar life and power cycling tests

R. Chaari, O. Briat, J.Y. Delétage, E. Woirgard, J.-M. Vinassa

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 404 KB

english, 2011

39

[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Effect of voids on crack propagation in AuSn die attach for high-temperature power modules

Arabi, F., Theolier, L., Youssef, T., Medina, M., Deletage, J.-Y., Woirgard, E.

Year:

2017

Language:

english

File:

PDF, 24.19 MB

english, 2017

40

Assessment of the Trench IGBT reliability: low temperature experimental characterization

S. Azzopardi, A. Benmansour, M. Ishiko, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2005

Language:

english

File:

PDF, 719 KB

english, 2005

41

[IEEE 2007 IEEE Power Electronics Specialists Conference - Orlando, FL, USA (2007.06.17-2007.06.21)] 2007 IEEE Power Electronics Specialists Conference - Failure mechanisms of Trench IGBT under various short-circuit conditions

Benmansour, A., Azzopardi, S., Martin, J.C., Woirgard, E.

Year:

2007

Language:

english

File:

PDF, 589 KB

english, 2007

42

Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling

O. Briat, J.-M. Vinassa, N. Bertrand, H. El Brouji, J.-Y. Delétage, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2010

Language:

english

File:

PDF, 2.47 MB

english, 2010

43

Reliability study of the assembly of a large EGA on a build up board using thermo-mechanical simulations

P. Guilbault, E. Woirgard, C. Zardini, D. Lambert

Journal:

Microelectronics Reliability

Year:

2002

File:

PDF, 1.42 MB

2002

44

Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation

Y. Belmehdi, S. Azzopardi, A. Benmansour, J.-Y. Delétage, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 890 KB

english, 2009

45

Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions

H. El Brouji, O. Briat, J-M. Vinassa, H. Henry, E. Woirgard

Journal:

Microelectronics Reliability

Year:

2009

Language:

english

File:

PDF, 530 KB

english, 2009

46

Strategy for designing accelerated aging tests to evaluate IGBT power modules lifetime in real operation mode

Thebaud, J., Woirgard, E., Zardini, C., Azzopardi, S., Briat, O., Vinassa, J.

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2003

Language:

english

File:

PDF, 1.97 MB

english, 2003

47

Ageing mechanisms in Deep Trench Termination (DT2) Diode

Baccar, F., Arbess, H., Theolier, L., Azzopardi, S., Woirgard, E.

Journal:

Microelectronics Reliability

Year:

2015

Language:

english

File:

PDF, 1.57 MB

english, 2015

48

High-temperature isothermal internal friction of copper and copper-aluminium solid solutions between 10 −4 and 10 Hz

Gaboriaud, R. J., Woirgard, J., Gerland, M., Riviere, A.

Journal:

Philosophical Magazine A

Year:

1981

Language:

english

File:

PDF, 823 KB

english, 1981

49

Nanoindentation characterization of SiC coatings prepared by dynamic ion mixing

J. Woirgard, T. Cabioc'h, J.P. Rivière, J.C. Dargenton

Journal:

Surface and Coatings Technology

Year:

1998

Language:

english

File:

PDF, 365 KB

english, 1998

50

Etud des reseaux de coincidence dans un reseau cristallin quelconque

J. Woirgard, J. de Fouquet

Journal:

Scripta Metallurgica

Year:

1972

Language:

french

File:

PDF, 297 KB

french, 1972

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